Technology Development
Solving Challenges, Creating the Future. The Driving Force of ASTI.
To achieve higher product performance and enhanced reliability, ASTI maintains an integrated development structure across three global sites in Japan, Vietnam, and India. This structure allows us to handle all aspects of development, including circuit design, artwork design, software design, mechanical design, and quality evaluation.
Our aim is to work closely with our customers to solve challenges together and achieve optimal design solutions.
Furthermore, we are also expanding our domains into power electronics that supports the electrified society, and medical devices utilizing advanced microfabrication technologies, driving the next generation of Monozukuri*.
ASTI's technology development is centered around three core categories, including those mentioned above.
*Monozukuri: Art of Manufacturing
Our aim is to work closely with our customers to solve challenges together and achieve optimal design solutions.
Furthermore, we are also expanding our domains into power electronics that supports the electrified society, and medical devices utilizing advanced microfabrication technologies, driving the next generation of Monozukuri*.
ASTI's technology development is centered around three core categories, including those mentioned above.
*Monozukuri: Art of Manufacturing
Product Development & Design Engineering
Starting from customer requirements, we drive circuit design, artwork design, mechanical design, and software development as an integrated process, supporting a wide range of electronically controlled products from automotive applications to consumer and industrial equipment.
We have established a robust development framework covering control technologies for autonomous driving, in-vehicle communications, wireless communications, motors, and batteries, while ensuring compliance with high reliability design standards, regulations and laws, functional safety (ISO 26262), and cybersecurity (ISO 21434).
By combining simulation technologies such as structural and thermal analysis with advanced mechanical design expertise including waterproofing and heat dissipation, we deliver high quality, high value added products that operate reliably even in harsh environments.
In addition, our collaborative development structure across Japan, Vietnam, and India enables fast, flexible Monozukuri that responds closely to local market needs.
From the concept phase through mass production launch, we provide best solutions through a seamless, end-to-end engineering environment.
We have established a robust development framework covering control technologies for autonomous driving, in-vehicle communications, wireless communications, motors, and batteries, while ensuring compliance with high reliability design standards, regulations and laws, functional safety (ISO 26262), and cybersecurity (ISO 21434).
By combining simulation technologies such as structural and thermal analysis with advanced mechanical design expertise including waterproofing and heat dissipation, we deliver high quality, high value added products that operate reliably even in harsh environments.
In addition, our collaborative development structure across Japan, Vietnam, and India enables fast, flexible Monozukuri that responds closely to local market needs.
From the concept phase through mass production launch, we provide best solutions through a seamless, end-to-end engineering environment.
Circuit Design
We support development and design across a wide range of control technologies, including autonomous driving (VCU/ADU/GNSS), in-vehicle communications (CAN/LIN/Ethernet), motors, and batteries. Our products comply with various international standards, including PSE・IEC・CE・JASO・RoHS.
Artwork Design
Simulation example:
Plane Resonance Analysis
Using the latest PCB CAD design environment, we support the design of multi-layer PCBs, build-up PCBs, IVH PCBs, aluminum PCBs, and copper inlay PCBs.
By utilizing SI, PI, and EMI analysis from the early stages of design, we pursue quality from the start, delivering highly reliable and high-performance PCBs (Printed Circuit Boards).
By utilizing SI, PI, and EMI analysis from the early stages of design, we pursue quality from the start, delivering highly reliable and high-performance PCBs (Printed Circuit Boards).
Mechanical Design
Busbar Insert Molding
Formation of fuse insertion sections
We deliver high durability product designs capable of withstanding harsh environments through our core expertise in waterproofing (potting, gasketing, and sealing), heat dissipation (water cooling, copper inlays, and busbars), laser welding, structural and thermal analysis.
Software
We support the development of highly reliable software that incorporates motor/power control, wireless communication (LTE-M, Wi-Fi, Bluetooth), MISRA C, functional safety, and cybersecurity.
We are also promoting Agile Development and Model Based Development(MBD).
We are also promoting Agile Development and Model Based Development(MBD).
Research and Development of Power Electronics
Utilizing our long-cultivated core technologies to advance the research and development of essential components, including chargers, DC/DC converters, and motor drive inverters, to contribute to the realization of a carbon-neutral society.
Through Research & Development, we develop highly reliable chargers for electric motorcycle and electric mobility, efficient DC/DC converters for diverse power needs and smooth, high performance motor drive inverters.
From standard to customized solutions, we create products that customers truly choose and trust.
Through Research & Development, we develop highly reliable chargers for electric motorcycle and electric mobility, efficient DC/DC converters for diverse power needs and smooth, high performance motor drive inverters.
From standard to customized solutions, we create products that customers truly choose and trust.
Magnetic Simulation Analysis
High-Efficiency Control based on Resonant Circuits
Vector Control Technology
Thermal Simulation Analysis
Research and Development of Advanced Medical and Healthcare Microdevices
We are actively conducting research and development of microdevices for medical and healthcare applications that contribute to improving the Quality of Life (QOL), utilizing and advancing the ultra-microfabrication technology cultivated through industry academia collaborative research.
Specifically, utilizing our unique microneedle technology, we are commercializing Drug Delivery System (DDS) devices, such as ultra-fine injection needles and syringes, that reduce medication waste and minimize invasiveness.
Furthermore, in cooperation with major manufacturers, we are utilizing micro-molding technology and bonding technology to promote the development of various microdevices used in cosmetics, in vitro diagnostics, and cell applications.
Specifically, utilizing our unique microneedle technology, we are commercializing Drug Delivery System (DDS) devices, such as ultra-fine injection needles and syringes, that reduce medication waste and minimize invasiveness.
Furthermore, in cooperation with major manufacturers, we are utilizing micro-molding technology and bonding technology to promote the development of various microdevices used in cosmetics, in vitro diagnostics, and cell applications.
DDS Device Design and Manufacturing Technology
We focus on securing intellectual property and developing products based on innovative & unique ideas, such as transverse hole microneedles and ultra-fine diameter injection needles. We also ensure reliabile medical device design in compliance with various standards, including ISO 13485 and ISO 14971.
DDS Device Evaluation Technology
We develop our own unique evaluation methods to handle devices that fall outside standard specifications, such as microneedle arrays and ultra-fine injection needles. We also conduct high-reliability evaluations compliant with various standards, including ISO 7864 and ISO 7886.
Micro-molding, Mold, and Bonding Technologies
We create original injection molding methods that break away from conventional approaches, such as those used for transverse hole microneedles and ultra-thin microchannel devices. Furthermore, we pursue unique expertise in the technology for bonding molded components.
